![]() ![]() The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.īesides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.ĮnhancementsPLUS AccuracyPLUS ProductivityPLUS FlexibilityįeaturesMulti-Chip CapabilityFlexibility for CustomizingOpen Platform Architecture Innovative Solution for Innovative Products ![]()
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